PCB-IC CARRIER BOARD DEFECT IDENTIFICATION
LCK10G
Used for automatic and laser marking of scrap units on carrier products, which facilitates efficient and accurate identification of subsequent processes, and improves the product yield and process efficiency of customer factories.

Product Data

Equipment characteristics

  • Double-station operation to realize high-speed processing of bad board marks on IC substrate
  • Configure energy monitoring system to ensure the stability of product processing effect
  • It can automatically identify the front end process mark, or connect to the customer system to directly obtain the location information of the scrap board for marking
  • The piracy mechanism realizes double-sided processing of the product, no adjustment is required when changing materials, which improves production efficiency and ease of use

 

ITEM

MAIN TECHNICAL PARAMETERS

 

Laser system

Laser type

Green laser 532nm

Average output power

10W

Field lens scanning range

150x150mm

 

 

Main configuration

Working platform

Dual linear motor platform

Vision system

Industrial CCD positioning and code reading system

Condition monitoring

Laser energy monitoring system

Automatic loading and unloading system

Loading and unloading drawer, vacuum adsorption system

 

Processing performance

Processing size range

50x70 – 120x300mm

Mark processing accuracy

±0.01mm

Overall machining accuracy

±0.05mm

Processing board thickness

0.1mm – 1.2mm

 

Use environment

Power supply specifications

Temperature 10 – 35/Humiditiy<65%

Environmental

2800mm(W) x 2000mm(L) x 2000mm(H)

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